Carrier frame and circuit board for an electronic device

ABSTRACT

An electronic device includes an electronic circuit board containing a processing element and a vision sensor. A carrier frame is used to support the electronic circuit board. An optical element is positioned over the sensor and supported by the carrier frame. The electronic circuit board is bent to reduce the length, thickness and/or width of the electronic device, without increasing the others of the length, thickness and/or width of the electronic device.

CROSS-REFERENCE TO RELATED APPLICATIONS

Not applicable.

STATEMENT REGARDING FEDERALLY SPONSORED RESEARCH OR DEVELOPMENT

Not applicable.

BACKGROUND OF THE TECHNOLOGY

The present technology relates to the assembly of an electronic device,and more specifically, to an electronic device assembled with a printedcircuit board and a carrier frame supporting the printed circuit board.

Most if not all electronic devices include one or more printed circuitboards (PCBs). During assembly, the board(s) are screwed to or otherwiseconnected to a portion of the electronic device's housing or otherboards within the housing. One type of electronic device is an imagingdevice, more generally referred to as a camera. An imaging device isgenerally used to inspect, locate and/or acquire an image of an object.For example, in manufacturing applications, imaging systems can be usedto detect defects in a manufactured object by acquiring images of theobject and using various types of image processing algorithms to analyzethe images. Unlike traditional cameras that use film to capture andstore an image, some imaging devices use various electronic,solid-state, and other devices including vision sensors, controllers,illumination devices, lenses, and the like.

Some imaging devices can include a housing with the solid state devicesmounted to several rigid PCBs, with the rigid PCBs held in the desiredconfiguration by the housing. One of the several rigid PCBs needs to bealigned with a lens, and the lens needs to be aligned with an opening inthe housing. Connectors are used to connect the one or more of the PCBstogether, which adds size, cost, assembly time, and possible areas forfailure. The size of the housing is limited to the size of the varioussolid-state devices and the rigid PCBs used to support them.

Improvements have been made in the area of printed circuit boards forelectronic devices. PCBs are now available in flexible form, and ahybrid of rigid and flexible, known as rigid-flex. The hybrid rigid-flexPCB generally consists of rigid and flexible substrates that arelaminated together into a single structure. Another form of PCB is knownas a rigidized flex construction, which is simply flex circuits thatinclude stiffeners attached to provide support for the electroniccomponents on the circuit board. A rigid-flex circuit typically hasconductors on the rigid layers, which differentiates it from multi-layercircuits with stiffeners.

The electronic devices of the prior art have several disadvantages innot only the assembly process, but in the overall size and limits on theserviceability of rigid circuit boards and reliability of PCBconnectors. What is needed are systems and methods that use a carrierframe to support the PCBs for easy assembly and for support of otherdevice components, without the problems and drawbacks associated withrigid PCBs.

BRIEF SUMMARY OF THE TECHNOLOGY

The present embodiments overcomes the disadvantages of the prior art byincorporating the use of a carrier frame to support PCBs. The PCB can bepositioned around and supported by the carrier frame, and additionalelectronic and solid-state devices can be supported by the PCB and/orthe carrier frame.

Accordingly, some embodiments comprise an adjustable lens device. Theadjustable lens device includes a lens, with the lens including a lensbase and a lens barrel extending from the lens base. The adjustable lensdevice can also include a carrier frame, with the carrier frameincluding an aperture, the aperture including a rim. The aperture can besized to receive at least the lens base. A lens focus fix can beincluded, with the lens focus fix including a ratchet portion and a lensretainer portion. The ratchet portion can include at least one ratchetarm extending from the ratchet portion, with the at least one ratchetarm including an engagement end, the engagement end being sized toengage at least one of a plurality of mating engagement apparatuspositioned about the rim. The lens retainer portion can include anengagement portion, the engagement portion to engage the lens torestrain movement of the lens. The lens focus fix can be rotatable toadjust a focal position of the lens, such that when the lens focus fixis rotated a first distance in a first direction, the lens retainerportion causes the lens to rotate a second distance in the firstdirection.

Other embodiments also comprise an electronic device. The electronicdevice includes an electronic circuit board containing a processingelement and a vision sensor, the electronic circuit board comprising aplurality of circuit boards coupled together with flexible circuitboard. A carrier frame can be used to support the electronic circuitboard. A lens can be positioned over the vision sensor and supported bythe carrier frame, the lens at least partially positioned within avolume defined by the electronic circuit board, with the lens positionbeing adjustable in relation to the carrier frame and the vision sensor.A lens focus fix can be coupled to the carrier frame and in contact withthe lens.

Consistent with the above, some embodiments include a method forassembling an electronic device. The method includes providing a carrierframe, with the carrier frame including a plurality of restraints tosupport an electronic circuit board; providing an electronic circuitboard, the electronic circuit board including a vision sensor and aprocessor; bending the electronic circuit board around at least aportion of the carrier frame; engaging the electronic circuit board withthe plurality of restraints; positioning a lens over the vision sensor,the carrier frame supporting the lens over the vision sensor; andrestraining the lens with a lens focus fix, the lens focus fixcontacting the lens and the carrier frame, such that rotating the lensfocus fix a first distance in a first direction causes the lens torotate a second distance in the first direction.

To the accomplishment of the foregoing and related ends, the technology,then, comprises the features hereinafter fully described. The followingdescription and the annexed drawings set forth in detail certainillustrative aspects of the technology. However, these aspects areindicative of but a few of the various ways in which the principles ofthe technology can be employed. Other aspects, advantages and novelfeatures of the technology will become apparent from the followingdetailed description of the technology when considered in conjunctionwith the drawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

FIG. 1 is a perspective view of one embodiment of an electronic devicein accordance with the present embodiments and showing one orientationof a rigid-flex PCB supported by a carrier frame;

FIG. 2 is an exploded view of an electronic device in accordance withthe present embodiments;

FIG. 3 is a plan view of the electronic device as seen in FIG. 1, andshowing an embodiment of a lens focus fix;

FIG. 4 is a perspective view in section of the lens focus fix as seen inFIG. 1;

FIG. 5 is a perspective view in section of an electronic device inaccordance with the present embodiments and showing an alternativeembodiment of a lens focus fix;

FIG. 6 is a perspective view in section of a portion of an electronicdevice in accordance with the present embodiments and showing analternative embodiment of a lens focus fix;

FIG. 7 is a perspective view of an electronic device in accordance withthe present embodiments and showing

FIG. 8 is a perspective view of an embodiment of the lens focus fix asseen in FIG. 7;

FIG. 9 is a plan view of the electronic device as seen in FIG. 1, andshowing an embodiment of a lens focus fix;

FIG. 10 is a perspective view of an electronic device in accordance withthe present embodiments and showing the carrier frame and vision sensorlens removed;

FIG. 11 is a perspective view of an optional configuration of anelectronic device, showing one portion of a rigid-flex PCB covering asubstantial portion of the carrier frame face and overlapping the visionsensor lens, in accordance with the present embodiments;

FIGS. 12-14 are views showing alternative configurations of therigid-flex PCB bent around and supported by the carrier frame, inaccordance with the present embodiments;

FIG. 15 is a perspective view of an electronic device in accordance withthe present embodiments and showing optional components coupled to thecarrier frame and/or rigid-flex PCB;

FIG. 16 is a perspective view of an optional configuration of anelectronic device, the electronic device including a liquid lensarrangement;

FIG. 17 is a partially exploded perspective view of an electronic devicepositioned within an enclosure, the enclosure including a heat sinkthermally coupled to the electronic device to draw heat away from theelectronic device;

FIG. 18 is a perspective view of the electronic device positioned withinthe enclosure, as seen in FIG. 17;

FIG. 19 is a partially exploded perspective view of an electronic devicepositioned within an enclosure, and showing an input/output board;

FIG. 20 is a perspective view of the electronic device shown in FIG. 19,and showing the input/output board including a connector coupleable toan illumination device;

FIG. 21 is a perspective view of an enclosed electronic device andincluding an illumination device, as shown in FIG. 20; and

FIG. 22 is a plan view of the electronic device as seen in FIG. 9, andshowing the electronic device enclosed and with a front cover providinga partial view of a lens focus fix;

FIG. 23 is a flow chart of a method associated with the electronicdevice.

While the technology is susceptible to various modifications andalternative forms, specific embodiments thereof have been shown by wayof example in the drawings and are herein described in detail. It shouldbe understood, however, that the description herein of specificembodiments is not intended to limit the technology to the particularforms disclosed, but on the contrary, the intention is to cover allmodifications, equivalents, and alternatives falling within the spiritand scope of the technology as defined by the appended claims.

DETAILED DESCRIPTION OF THE TECHNOLOGY

The various aspects of the subject technology are now described withreference to the annexed drawings, wherein like reference numeralscorrespond to similar elements throughout the several views. It shouldbe understood, however, that the drawings and detailed descriptionhereafter relating thereto are not intended to limit the claimed subjectmatter to the particular form disclosed. Rather, the intention is tocover all modifications, equivalents, and alternatives falling withinthe spirit and scope of the claimed subject matter.

As used herein, the terms “component,” “system,” “device” and the likeare intended to refer to either hardware, a combination of hardware andsoftware, software, or software in execution. The word “exemplary” isused herein to mean serving as an example, instance, or illustration.Any aspect or design described herein as “exemplary” is not necessarilyto be construed as preferred or advantageous over other aspects ordesigns.

Furthermore, the disclosed subject matter may be implemented as asystem, method, apparatus, or article of manufacture using standardprogramming and/or engineering techniques and/or programming to producehardware, firmware, software, or any combination thereof to control anelectronic based device to implement aspects detailed herein.

Unless specified or limited otherwise, the terms “mounted,” “connected,”“supported,” and “coupled” and variations thereof are used broadly andencompass both direct and indirect mountings, connections, supports, andcouplings. Further, “connected” and “coupled” are not restricted tophysical or mechanical connections or couplings. As used herein, unlessexpressly stated otherwise, “connected” means that one element/featureis directly or indirectly connected to another element/feature, and notnecessarily electrically or mechanically. Likewise, unless expresslystated otherwise, “coupled” means that one element/feature is directlyor indirectly coupled to another element/feature, and not necessarilyelectrically or mechanically.

As used herein, the term “processor” may include one or more processorsand memories and/or one or more programmable hardware elements. As usedherein, the term “processor” is intended to include any of types ofprocessors, CPUs, microcontrollers, digital signal processors, or otherdevices capable of executing software instructions.

As used herein, the term “memory medium” includes a non-volatile medium,e.g., a magnetic media or hard disk, optical storage, or flash memory; avolatile medium, such as system memory, e.g., random access memory (RAM)such as DRAM, SRAM, EDO RAM, RAMBUS RAM, DR DRAM, etc.; or aninstallation medium, such as software media, e.g., a CD-ROM, or floppydisks, on which programs may be stored and/or data communications may bebuffered. The term “memory medium” may also include other types ofmemory or combinations thereof.

Embodiments of the technology are described below by using diagrams toillustrate either the structure or processing of embodiments used toimplement the embodiments of the present technology. Using the diagramsin this manner to present embodiments of the technology should not beconstrued as limiting of its scope. The present technology contemplatesboth an electronic device configuration and systems and methods forassembling and using an electronic device having a carrier frame tosupport PCBs.

The various embodiments of an electronic device will be described inconnection with an imaging device that is assembled using a carrierframe, with rigid-flex PCB positioned or bent on, in, and/or around thecarrier frame. That is because the features and advantages of thetechnology are well suited for this purpose. Still, it should beappreciated that the various aspects of the technology can be applied inother forms of electronic devices and PCBs and in other systems andassemblies that may benefit from using rigid-flex PCB and a carrierframe. Use of rigid-flex PCB positioned around a carrier frame reducescost and results in a compact cubical form for electronic devices.Rigid-flex PCB and a carrier frame can be used to reduce at least one ofa length, a thickness, and a width of the electronic device, withoutincreasing the others of the length, the thickness, and the width.

An exemplary imaging device can be embedded into other electronicdevices to add machine vision and/or code reading functions, and canalso be a standalone imaging device. When embedded, such an electronicdevice can be an industrial, medical, mobile, or retail device, asnon-limiting examples, and can be used in a manufacturing assembly,test, measurement, automation, and/or control application, among others,as non-limiting examples. When standalone, the imaging device can beintegrated into an enclosure, and can include connectors, I/O, powercircuitry, and user interface components, for example. The exemplaryimaging device may use image acquisition software operable to performany of various types of image acquisitions. The imaging device canperform machine vision tasks and/or decode images containing machinereadable symbols, as non-limiting examples.

Referring to FIG. 1, the various embodiments described herein can reducethe size and/or cost of an imaging device 50. In some embodiments, someor all of the electronic components can be placed on one or morerigid-flex PCBs 52 that can be positioned on and/or in and/or around acarrier frame 54. The carrier frame 54 can support the PCB 52 and othercomponents, including imaging device mechanics, electronics, and/orimaging device optics. In this way, the imaging device can achieve amaximal PCB area with a minimal cubical size. The overall size of theimaging device 50 can be reduced by use of the rigid-flex PCB 52 bent orfolded around the carrier frame 54. This reduction in size can beachieved by subsuming a lens barrel volume within the interior of thefolded PCB 52.

In order to optimize heat dissipation, embodiments can include some orall heat producing components placed on the PCB 52 to be facing to theoutside of the imaging device 50 to help radiate heat away from theimaging device. In some embodiments, a connection between differentboard configurations of the PCB 52 can be achieved by a flexiblecomponent 82 of the rigid-flex PCB 52.

Referring now to FIG. 2, an exemplary imaging device 50 generallyincludes a rigid-flex PCB 52 and a carrier frame 54. The rigid-flex PCB52 can comprise a variety of board configurations that includeprocessing elements. In the embodiment shown in FIG. 2, the rigid-flexPCB can include a main board 56, a sensor board 58, a power and I/Oboard 60, and an illumination board 62. It is to be appreciated that anyof these boards can be removed or replaced with other boards, andcomponents discussed or shown in the Figures can be moved from one boardto another. The specific board names are not to be limiting, and aremerely named for simplicity and not to define a specific form orfunction.

The main board 56 can generally include a processor 64 used for imageprocessing and decoding. The processor 64 can be encoded with softwarethat is configured to, among other things, control illumination, acquireimage data, and process the acquired image data into usable information.Image processing can include known operations including inspection,alignment, and measurements, as non-limiting examples. A memory medium66 can also be included on the main board 56 for storing imagingsoftware, images, and buffering data and the like.

The sensor board 58 can generally include a vision sensor 68. The visionsensor 68 serves to convert light entering through a lens 70 intoelectrons to create an image. The lens 70 focuses image data, i.e.,reflected light from an image, onto the vision sensor 68. The lens 70can be positioned over the vision sensor 68 on the sensor board 58 toprovide a view of an object in the field of view (FOV) to the visionsensor 68. In order to protect the vision sensor 68 from dust and straylight, a sealant, such as a double adhesive sealing tape 92, can beused, for example, and can be positioned around the outer edge 94 of thevision sensor 68, and can be adhered to the sensor board. In someembodiments, a web of thermal insulator material 74 can be placedbetween components and/or boards to help reduce heat flow. For example,insulator material 74 can be positioned between the vision sensor 68 andthe processor 64 to help reduce heat flow.

An aiming device 72, such as a known LED and/or laser diode can beincluded on the sensor board 58. The aiming device can provide anindication, e.g. a visual indication such as a dot or X, for example, ofthe center of the FOV of the imaging device 50. The aiming device 72 canbe positioned on the sensor board 58, or any of the other boards, andthe carrier frame 54 can include an aperture 124 to allow the LED beamor laser beam (not shown) to pass. An aimer lens 126 can be placed infront of or on top of the aiming device 72 to adjust the aimer outputangle and/or uniformity, for example. The aimer lens 126 can be replacedby other types of lenses to meet different application requirements. Thecarrier frame 54 can include a recess 128 that can be used to secure theaimer lens 126 to the carrier frame 54. The aimer lens 126 can includeone or more tabs or hold downs 130 that secure the aimer lens, andpossibly the illumination board 62, to the carrier frame 54. In otherembodiments, an adhesive tape or film can be used, alone or incombination with the hold downs 130, to secure the aimer lens 126 to thecarrier frame 54.

The power and I/O board 60 can generally include power managementcircuitry 76 and analog and/or digital input and output (I/O)connector(s) 78 for a variety of optional devices and/or to couple to acommunication network, for example. The illumination board 62 can alsoinclude I/O connector(s) 78, and can also include, among other things,an illumination device 80, e.g., an LED or LEDs, for objectillumination. The illumination device 80 can be a known LED, forexample. Similar to the aimer lens 126, in some embodiments, anillumination lens 114 can be placed in front of or on top of theillumination device 80 to adjust the light output angle and/oruniformity, for example. The illumination lens 114 can be replaced byother types of lenses to meet different illumination requirements. Theillumination board 62 can be sized and shaped to include a recess 116 orother structure or fastener mechanism that can be used to secure theillumination lens 114 to the carrier frame 54. The illumination lens 114can also be used to retain the illumination board 62 to the carrierframe 54. Similar to the aimer lens 126, in some embodiments, theillumination lens 114 can include one or more tabs or hold downs 120that secure the illumination lens, and/or possibly the illuminationboard 62, to the carrier frame 54 (see FIG. 15). It is to be appreciatedthat the carrier frame 54 may also include a retention feature so as toallow the illumination lens 114 to be retained on the carrier frame 54.In other embodiments, an adhesive tape or film 122 can be used, alone orin combination with the hold downs 120, to secure the illumination lens114 to the illumination board 62 and/or carrier frame.

The carrier frame 54 can be a molded, formed, and/or machined component,and can be sized and shaped so as to provide a support structure forsome or all of the boards 56, 58, 60, and 62, and for supporting one ormore optics and/or additional imaging device components as discussedbelow. The carrier frame 54 can also include a plurality of PCBrestraints 90. In the embodiment shown, the carrier frame 54 includesfour PCB restraints 90 (the left rear PCB restraint is hidden fromview), although more or less can be used. Six PCB restraints 90 are usedin FIG. 11. As shown in FIGS. 1 and 2, for example, the PCB restraints90 can be biased to provide a snap-fit for any of the boards. As can beseen, the main board 56, the sensor board 58, the power and I/O board60, and/or the illumination board 62 can be held in place on, in, and/oraround the carrier frame 54 using the PCB restraints 90, and/or thecarrier frame itself.

Traditional imaging devices include a lens that is factory calibratedfor a specific focal distance, and without the option for useradjustment. Different focal distances required a different imagingdevice. Other traditional imaging devices provide some lens adjustmentcapability, but require tools and disassembly of the imaging device,even for small or minor fine tuning adjustments. To overcome theselimitations, the carrier frame 54 can include an aperture 88 sized tosupport the main imaging lens 70. The aperture 88 can be threaded toallow the lens 70 to be replaced and/or rotated to adjust the lensfocus. This provides the ability to focus the imaging device byadjusting the lens 70 instead of moving the imaging device 50. In someembodiments, the lens 70 can include a threaded base 96, and the carrierframe 54 can include mating threads 98 in the aperture 88 to support thelens, and to allow the lens 70 to be rotated to adjust a distancebetween the lens 70 and the vision sensor 68 for focusing. In someapplications, the lens can be secured with a lens focus fix 100 torestrain the lens from rotating on its own.

Imaging devices, when used in a manufacturing assembly, test,measurement, automation, and/or control application, for example, can besubject to harsh operating environments including vibrations andtemperature variations that can cause thermal expansion and contraction.These environmental factors can cause the lens to rotate on its own,which can eventually cause the lens to get out of focus, possiblycausing unsatisfactory results. The lens focus fix 100 can not onlyserve to restrain the lens 70 from rotation in these harsh environments,but in some embodiments, the lens focus fix 100 can also allowadjustment of the lens 70 without the use of tools, while at the sametime restraining the lens.

Referring to FIGS. 3 and 4, the lens focus fix 100 can be a formed fitand snapped or pressed into place by a user to restrain the lens 70, andcan be rotated to provide discrete steps of lens adjustment to adjustthe focal position of the lens 70, all without the use of tools. In someembodiments, the lens focus fix 100 can comprise a base 134, a ratchetportion 136, and a lens retainer portion 138. In some embodiments, theratchet portion 136 can include at least one ratchet arm 140 extendingfrom the base 134. The ratchet arm 140 can include a protrusion 142extending from an engagement end 144 of the ratchet arm 140. Theprotrusion 142 can be sized and configured to engage a mating engagementapparatus 146, such as one of a plurality of recesses 146 positionedabout a recessed rim 148 of the aperture 88. The ratchet arm 140 canapply a radially extending force such that the engagement end 144 isbiased toward the mating engagement apparatus 146. As shown, the lensfocus fix 100 includes six ratchet arms 140, although more or less arecontemplated. Each protrusion 142 and recess 146 provides a discretefocal position for the lens 70. In some embodiments, the recessed rim148 can include a cutout 150 where a ratchet arm 140 and associatedprotrusion 142 does not contact a recession 146. It is to be appreciatedthat other latching mechanisms may be used, including where the rim 148can include protrusions 142 and the engagement end 144 can include arecess 146, for example.

The lens retainer portion 138 can contact and engage a barrel 106 of thelens, either partially or substantially surrounding the barrel 106. Asshown in FIG. 3, the retainer portion 138 can include an engagementportion 150, such as a plurality of ribs 150 to contact and engage thebarrel 106 and keep the lens 70 from rotating. Three ribs 150 are shown,although more or less ribs are contemplated.

In use, a user can install and provide an adjustment for a lens 70 byrotating the threaded lens 70 within the threaded aperture 88. The usercan then position the lens focus fix 100 over the lens 70 and insert thelens focus fix 100 into the recessed rim 148 and over the lens barrel106. The lens 70 is now restrained from rotating on its own. To providea fine-tuned focal adjustment for discrete focal positions, the user cangrip the ratchet portion 136 and rotate the ratchet portion, in either aclockwise direction or a counter clockwise direction 152, to discretelyadjust the focal position for the lens 70. The ratchet arms 140 andassociated recesses 146 serve to provide the discrete adjustmentpositions, while the lens retainer portion 138 restrains the position ofthe lens in relation to the lens focus fix 100. For example, when thelens focus fix 100 is rotated a distance in a first direction, the lensretainer portion 138 causes the lens 70 to also rotate a distance in thefirst direction along with the lens focus fix 100. The rotationaldistance of the lens focus fix 100 and the lens 70 can be the same, orgearing could be included, for example, to step up or step down therotational distance of the lens 70.

Referring to FIG. 5, in some embodiments, the lens focus fix cancomprise a lens focus fix ring 102, and can be positioned over the lens70 to secure the lens in a desired focal position and keep the lens fromrotating. Similar to the lens focus fix 100, the lens focus fix ring 102can be positioned over the lens 70 and inserted into the recessed rim148 and over the lens barrel 106. The lens 70 is now restrained fromrotating on its own. To provide a fine tuned focal adjustment, the usercan remove the lens focus fix ring 102, rotate the threaded lens 70within the threaded aperture 88, in either a clockwise direction or acounter clockwise direction, to adjust the focal position for the lens70. The user can then reposition the lens focus fix ring 102 over thelens 70 and insert the lens focus fix ring 102 into the recessed rim 148and over the lens barrel 106. The lens focus fix ring 102 can alsoinclude a retainer portion 138 to keep the lens 70 from rotating. Theretainer portion 138 can contact and engage the barrel 106 of the lens70, either partially or substantially surrounding the barrel 106.

Referring to FIG. 6, in other embodiments, the lens focus fix cancomprise a lens focus fix plug 108, and can be positioned on or withinthe carrier frame 54. The lens focus fix plug 108 can include a contactportion 110. The contact portion 110 can be threaded to engage thethreaded base 96 on the lens 70, and/or the contact portion 110 can be agenerally soft material, e.g., plastic or rubber, to engage the lens 70and keep the lens from rotating. In some embodiments, both a lens focusfix 100, or lens focus fix ring 102, and the lens focus fix plug 108 canbe used.

Referring to FIGS. 7 and 8, an alternative embodiment of a lens focusfix 250 is shown. Similar to the lens focus fix 100, the lens focus fix250 can be a formed fit and snapped or pressed into place by a user torestrain the lens 70. The lens focus fix 250 can be rotated to providediscrete steps of lens adjustment to adjust the focal position of thelens 70, all without the use of tools. In some embodiments, the lensfocus fix 250 can include a slot 274 to allow a tool, e.g., ascrewdriver or similar device, to rotate the lens focus fix. The lensfocus fix 250 along with a restraint 252 can provide a predeterminednumber of fixed focal positions that can be achieved by rotation of thelens focus fix 250.

In some embodiments, the lens focus fix 250 can comprise a base 262, aratchet portion 258, and a lens retainer portion 268. The base 262 canbe grasped by a user to rotate the lens focus fix 250. A side wall 278of the ratchet portion 258 can include a predetermined number ofengagement apparatus 256 and at least one stop protrusion 260. Eachengagement apparatus 256, such as one of a plurality of recesses 256, incooperation with the restraint 252, can provide a discrete focalposition for the lens 70. The stop protrusion 260 can be sized andconfigured to prevent a turn of the lens focus fix 250 over apredetermined amount of degrees (e.g., 180 or 270 degrees, or more orless).

Referring to FIG. 9, the restraint 252 can be secured to the carrierframe 54 by a variety of means, such as a rivet or screw 272. Therestraint 252 can include a ratchet arm 264 and a biasing arm 265extending from a base 274. The ratchet arm 264 can include a protrusion266 extending from an engagement end 276 of the ratchet arm 264. Theprotrusion 266 can be sized and configured to engage one of theplurality of recesses 256 positioned about the ratchet portion 258. Theratchet arm 264 can apply a force, such as a radially extendingcompression force, such that the engagement end 276 is biased toward amating recess 256. As shown, the lens focus fix 250 includes threerecesses 256, although more or less are contemplated. Each recess 256provides a discrete focal position for the lens 70, such that theprotrusion 266 snap locks into place into one of the recesses 256. Byturning the lens focus fix 250, the protrusion 266 can be unlocked fromthe recess 256 and find the next recess 256 and relock. In someembodiments, each recess 256 can have an associated visual indicator 270that indicates the focal position. It is to be appreciated that otherlatching mechanisms may be used, including where the ratchet portion 258can include protrusions 266 and the engagement end 276 can include arecess 256, for example.

The lens retainer portion 268 can contact and engage the barrel 106 ofthe lens 70, either partially or substantially surrounding the barrel106. As best seen in FIGS. 8 and 9, the retainer portion 138 can includean engagement portion 254, such as a plurality of ribs 254 to contactand engage the barrel 106 and keep the lens 70 from rotating. Three ribs254 are shown, although more or less ribs are contemplated.

To provide a fine-tuned focal adjustment for discrete focal positions,the user can grip and rotate the base 262, in either a clockwisedirection or a counter clockwise direction 152, to discretely adjust thefocal position for the lens 70. The protrusion 266 and associatedrecesses 256 serve to provide the discrete adjustment positions, whilethe lens retainer portion 268 restrains the position of the lens 70 inrelation to the lens focus fix 250. For example, when the lens focus fix250 is rotated a distance in a first direction, the lens retainerportion 268 causes the lens 70 to also rotate a distance in the firstdirection along with the lens focus fix 250. The rotational distance ofthe lens focus fix 250 and the lens 70 can be the same, or gearing couldbe included, for example, to step up or step down the rotationaldistance of the lens 70. In FIG. 9, the lens focus fix 250 would only berotatable in a counter clockwise direction because the stop protrusion260 is restricting rotation of the lens focus fix 250 in the clockwisedirection.

Referring to FIG. 10, in some embodiments, each board 56, 58, 60, and 62can be of a generally rigid PCB construction with flexible PCB 82coupling one or more of the rigid boards together, described herein as arigid-flex PCB. It is to be appreciated that flexible PCB may also beused in whole or in part. In one embodiment, the sensor board 58 can bepositioned above and coupled to the main board 56 with flexible PCB 82.This orientation allows the vision sensor 68 to be positioned such thatthe lens 70 can be positioned above the vision sensor. The power and I/Oboard 60 can be coupled to the main board 56 with flexible PCB 82, andcan extend upward toward the face 84 of the imaging device (see FIG.11). The power and I/O board 60 can also be coupled to the sensor board58, for example, instead of the main board 56. The illumination board 62can then be coupled to the power and I/O board with flexible PCB 82. Theillumination board 62 can also be coupled to the sensor board 58, forexample.

Referring to FIG. 11, in some embodiments, the illumination board 62 canextend and cover some or a substantial portion of the face 84 of theimaging device 50. In this embodiment, the extended illumination board62 can cover a portion of the lens 70, leaving only an aperture 86through the illumination board 62 sized to allow sufficient light toenter the lens 70 as needed.

FIGS. 12-14 show alternative embodiments where the rigid-flex PCB 52 canbe positioned around the carrier frame 54 in a variety of differentways. In FIG. 12, the carrier frame has been removed to better showpossible rigid-flex PCB orientations. In FIG. 12, for example, the mainboard 56 is positioned on an opposite side of the imaging device fromthe power and I/O board 60. In FIGS. 13 and 14, alternative boardconfigurations are show where aiming devices 72 and/or illuminationdevices 80 can be positioned on one or more boards, e.g., on a board(s)that surrounds and/or can be positioned next to or near the lens 70. Inaddition, the flexible PCB 82 can extend from any side of the variousPCBs to meet any size or shape constraints, and/or various carrier frame54 configurations.

Referring to FIG. 15, to support different lenses 154, a lens extender112 can be coupled or mounted to the carrier frame 54, or can be a partof the carrier frame. The lens extender 112 can be internally and/orexternally threaded so it can be threaded to the carrier frame 54, andallow a variety of different lenses, such as lens 154, to be threaded tothe lens extender 112. In this way, different lenses having differentfocal points and/or imaging characteristics, for example, can be mountedto the imaging device 50, thereby increasing the applications for whichit can be used.

In some applications, the distance between the vision sensor 68 and anobject to be imaged may vary between uses. In these cases, in order toobtain useful images (i.e., images from which data required to completeimaging processes can be extracted), an adjustable lens and auto-focussystem can be provided. In these cases, when the imaging device isactivated to perform a vision process, the lens and auto-focus systemcan automatically focus the lens so that a clear image of the object tobe imaged can be generated on the vision sensor, and can be processed tocomplete the imaging process.

Referring to FIG. 16, one type of lens that can be used with the imagingdevice is a liquid lens 132. Liquid lenses can be constructed of one ormore fluids of different refractive indexes, and can be varied bycontrolling the meniscus, or surface of the liquid. In one type ofliquid lens, for example, two fluids are contained in a tube withtransparent end caps. The first is an electrically conducting aqueoussolution, and the second is a non-conducting oil. The interior of thetube is coated with a hydrophobic material, which causes the aqueoussolution to form a hemispherical lens which can be adjusted by applyinga DC voltage across the coating to decrease its water repellency in aprocess called electrowetting. Electrowetting adjusts the surfacetension of the liquid changing the radius of curvature and adjusting thefocal length of the lens.

Liquid lenses are extremely versatile, providing a highly variable focallength, without the need for moving parts. The imaging device 50 cansupport a liquid lens 132 and can be connected to the imaging device viaa flex connector 156 coupled to connector 78 on the illumination board62, for example, or connector 156 could be connected to a flex part 82of the rigid-flex PCB 52, for example.

Traditional imaging devices are physically coupled using a communicationcable to a computer or similar device that includes sufficientprocessing power. The traditional imaging device is used to acquire animage, and the image is then uploaded to the computer for imagedecoding. In this way, the traditional imaging device only includesenough processing power to acquire and transfer the image, with theprocessing intensive activities taking place on the computer where spaceand heat generation can be more easily managed. As is known, processorsthat run process intensive activities, such as image decoding, can belarge in size and can produce a significant amount of heat as abyproduct of the processing activities.

In some embodiments, processor 64 can be sized and configured to processan image, as compared to transferring the image to a computer forprocessing. This processing of the image on the imaging device 50 canproduce significant heat and can also require additional PCB space for aphysically larger processor. In addition, with processing taking placeon the imaging device 50, more signals can be generated that need to betransferred between components. Use of the rigid-flex PCBs 52 can reduceand/or eliminate additional connectors between traditional rigid circuitboards that require connectors to couple two or more rigid circuitboards together.

As previously discussed, in order to optimize the heat dissipation,embodiments can include some or all heat producing components placed onthe rigid-flex PCBs 52 to be facing to the outside of the imaging device50 to help radiate heat away from the imaging device. In someembodiments, the processor 64 and the vision sensor 68 can be ondifferent boards comprising the rigid-flex PCB 52 so as to separate theheat producing processor 64 from the heat sensitive vision sensor 68.

In other embodiments, one or more heat sinks 180 can be thermallycoupled to the imaging device 50 to dissipate heat to the environment.FIG. 17 shows a bottom view of the imaging device 50, where an enclosure184, or portions of the enclosure 184, can serve as the heat sink 180,while in other embodiments, heat sink(s) 184 can be thermally coupled tocomponents of the imaging device 50, and then placed inside a separateenclosure, for example. A thermal gap filler 182 can be used, as isknown, to couple the processor 64, for example, or other devices on therigid-flex PCB 52, to the heat sink 180. The heat sink 180 can be madeof known heat sink materials, such as copper and/or aluminum, forexample. The enclosure 184 can be made of plastic materials, forexample.

In the embodiment of FIG. 17, three sides of the imaging device 50 areshown to be thermally coupled to the heat sink 180. It is to beappreciated that the heat sink 180 can be configured to thermally coupleto more or less that the three sides, and in some embodiments, the heatsink 180 can be thermally isolated from one or more sides of the imagingdevice 50. The enclosure 184 is shown to include a top portion 186, abottom portion 188, a front cover 190, and the heat sink 180 serving asside walls of the enclosure 184. In some embodiments, one or more I/Oand/or communication cables 192 can extend though a rear wall 194 andcouple to an input/output board 198 that is coupled to the imagingdevice 50. The top portion 186, bottom portion 188, heat sink 180, andfront cover 190 can be assembled and secured together using screws 196,for example. The front cover 190 can be a snap fit to allow removalwithout tools to access the lens focus fix 100 and lens focus fix ring102 for adjustment of the lens 70. FIG. 18 illustrates imaging device 50within enclosure 184.

Referring to FIGS. 19-21, a top view of the imaging device 50 andassociated enclosure 184 is shown. In FIGS. 19 and 20, the input/outputboard 198 is better seen, and is shown coupled to the imaging deviceusing flexible PCB 82. In some embodiments, the flexible PCB 82 canextend through a slot 200 in the input/output board 198. Theinput/output board 198 can be coupled to the heat sink 180 and/or thehousing 184, and can include one or more indicators, such as LEDs 202,as a user interface.

The input/output board 198 can include a connector 206, such as a knownboard-to-board connector, to allow the imaging device 50 to control anadditional illumination device. For example, as best seen in FIG. 20, anillumination device 210 having at least one illumination device 81 and amating connector 212 can couple to the connector 206. In someembodiments, the illumination device 210 can be part of a packagedproduct or unit 216, as shown in FIG. 21. In other embodiments, theillumination device 210 can be a remote illumination device, e.g., notpart of a packaged product or unit, yet coupled to and under control ofthe imaging device 50.

Referring to FIG. 22, an imaging device 50 including a lens focus fix250 is shown within an enclosure 184. The enclosure 184 can include afront cover 190. In this embodiment, the front cover 190 can include amasked portion 280 and a clearance portion 270 in the front cover 190.The clearance portion can be sized to allow visual access to theselected visual indicator 270 that references the selected lens focalposition. The remaining visual indicators 270 for the remaining focalpositions can be obstructed by the masked portion 280.

FIG. 23 illustrates an embodiment of a method for assembling anelectronic device using a carrier frame 54 and rigid-flex PCBs 52. Themethod shown in FIG. 23 may be used in conjunction with any of thesystems or devices shown in the above Figures, among others. In variousembodiments, some of the method elements shown may be performedconcurrently, in a different order than shown, or may be omitted.Additional method elements may also be performed as desired.

Referring to FIG. 23, a method 160 is shown for assembling an electronicdevice using a carrier frame 54 and rigid-flex PCBs 52. A first step isto provide a carrier frame 54 adapted to support one or more electroniccircuit boards, in this case, rigid-flex PCBs 52, as indicated atprocess block 162. As previously described, the carrier frame 54 caninclude a plurality of restraints 90 to support the rigid-flex PCBs 52.At process block 164, the rigid-flex PCBs 52 are provided, and atprocess block 166 and 168, the rigid-flex PCBs 52 can be bent or foldedand engaged with the carrier frame 54. In some embodiments, therigid-flex PCBs 52 can include a vision sensor 68. With the rigid-flexPCBs 52 positioned on, in, and/or around the carrier frame 54, the lens70 can be positioned over the vision sensor 68, with the carrier frame54 supporting the lens 70 over the vision sensor 68, as indicated atprocess block 170. With the lens 70 positioned, at process block 172,the lens 70 can be restrained with a lens focus fix 100. In someembodiments, the lens focus fix 100 can contact both the lens 70 and thecarrier frame 54 to restrain the lens 70 from rotating on its own, andto allow for adjustment of the positioning of the lens 70.

Although the present technology has been described with reference topreferred embodiments, workers skilled in the art will recognize thatchanges may be made in form and detail without departing from the spiritand scope of the technology. For example, the present technology is notlimited to the embodiments of smart cameras and associated devices shownherein and may be practiced with other linescan cameras.

The particular embodiments disclosed above are illustrative only, as thetechnology may be modified and practiced in different but equivalentmanners apparent to those skilled in the art having the benefit of theteachings herein. Furthermore, no limitations are intended to thedetails of construction or design herein shown, other than as describedin the claims below. It is therefore evident that the particularembodiments disclosed above may be altered or modified and all suchvariations are considered within the scope and spirit of the technology.Accordingly, the protection sought herein is as set forth in the claimsbelow.

What is claimed is:
 1. An adjustable lens device comprising: a lens, thelens including a lens base and a lens barrel extending from the lensbase; a carrier frame, the carrier frame including an aperture, theaperture including a rim, the aperture being sized to receive at leastthe lens base; a lens focus fix, the lens focus fix including a ratchetportion and a lens retainer portion; the ratchet portion including atleast one ratchet arm extending from the ratchet portion, with the atleast one ratchet arm including an engagement end, the engagement endsized to engage at least one of a plurality of mating engagementapparatus positioned about the rim; the lens retainer portion includingan engagement portion, the engagement portion to engage the lens torestrain movement of the lens; and the lens focus fix being rotatable toadjust a focal position of the lens, such that when the lens focus fixis rotated a first distance in a first direction, the lens retainerportion causes the lens to rotate a second distance in the firstdirection.
 2. The adjustable lens device according to claim 1: whereinwhen the lens focus fix is rotated in the first direction, theengagement end of the at least one ratchet arm shifts from one of theplurality of engagement apparatus to another of the plurality ofengagement apparatus causing a discrete movement of the lens focus fixand a discrete movement of the lens in the first direction.
 3. Theadjustable lens device according to claim 1: wherein the lens base isthreaded and the aperture is threaded such that the aperture threadablyreceives the lens, and when the lens focus fix is rotated in the firstdirection, the lens retainer portion causes the lens to threadablyrotate in the first direction with the lens focus fix.
 4. The adjustablelens device according to claim 1: wherein the carrier frame includes aplurality of restraints to support an electronic circuit board.
 5. Theadjustable lens device according to claim 1: wherein the apertureincludes a recessed rim, the lens focus fix being sized to fit at leastpartially within a space defined by the recessed rim, and the lens focusfix being rotatable within the space defined by the recessed rim.
 6. Theadjustable lens device according to claim 1: wherein the adjustable lensdevice is an imaging device, the imaging device further including avision sensor and a processor to process an image acquired by theimaging device.
 7. The adjustable lens device according to claim 6:wherein the lens focus fix is rotatable to adjust a distance between thelens and the vision sensor.
 8. An electronic device comprising: anelectronic circuit board containing a processing element and a visionsensor, the electronic circuit board comprising a plurality of circuitboards coupled together with flexible circuit board; a carrier frame tosupport the electronic circuit board; a lens positioned over the visionsensor and supported by the carrier frame, the lens at least partiallypositioned within a volume defined by the electronic circuit board, thelens position being adjustable in relation to the carrier frame and thevision sensor; and a lens focus fix coupled to the carrier frame and incontact with the lens to restrain movement of the lens.
 9. Theelectronic device according to claim 8: wherein an aimer device issupported by at least one of the plurality of circuit boards, and anexchangeable lens is positioned over the aimer device, the exchangeablelens supported by at least one of the carrier frame and the at least oneof the plurality of circuit boards.
 10. The electronic device accordingto claim 8: wherein an illumination device is supported by at least oneof the plurality of circuit boards, and an exchangeable lens ispositioned over the illumination device, the exchangeable lens supportedby at least one of the carrier frame and the at least one of theplurality of circuit boards.
 11. The electronic device according toclaim 8: wherein the lens focus fix comprises a base, a ratchet portionhaving a side wall coupled to the base, and a lens retainer portioncoupled to the ratchet portion, the side wall including an engagementapparatus and a stop protrusion; and a restraint to engage theengagement apparatus.
 12. The electronic device according to claim 8:wherein the lens is adjustably threaded to the carrier frame.
 13. Theelectronic device according to claim 8: wherein the processing elementacquires image data from the vision sensor and processes the acquiredimage data into a processed image.
 14. The electronic device accordingto claim 8: wherein the processing element is arranged on an outwardlyfacing surface of the electronic circuit board when the electroniccircuit board is supported by the carrier frame to facilitate areduction in heat from the electronic device.
 15. The electronic deviceaccording to claim 14: further comprising a heat sink, the heat sink inthermal communication with an outwardly facing surface of the processingelement.
 16. The electronic device according to claim 15: furthercomprising an enclosure to at least partially house the electronicdevice, the heat sink comprising at least a portion of the enclosure.17. The electronic device according to claim 8: wherein the lens focusfix comprises a base, a ratchet portion coupled to the base, and a lensretainer portion coupled to the base.
 18. The electronic deviceaccording to claim 17: wherein the ratchet portion comprises a ratchetarm, the ratchet arm including an engagement end.
 19. The electronicdevice according to claim 17: wherein the lens retainer portioncomprises at least one engagement portion, the engagement portion tocontact a barrel of the lens.
 20. An electronic device comprising: anelectronic circuit board containing a processing element and a visionsensor, the electronic circuit board comprising a plurality of circuitboards coupled together with flexible circuit board; a carrier frame tosupport the electronic circuit board; a lens positioned over the visionsensor and supported by the carrier frame, the lens at least partiallypositioned within a volume defined by the electronic circuit board, thelens position being adjustable in relation to the carrier frame and thevision sensor; and the plurality of rigid circuit boards coupledtogether having a rectangular shape when unfolded, and is folded arounda plurality of vertical corners of the carrier frame.
 21. The electronicdevice according to claim 20: wherein the lens comprises a liquid lens,the liquid lens to control a focal distance of the electronic device.22. The electronic device according to claim 20: wherein one of theplurality of rigid circuit boards includes an aperture, the one of theplurality of rigid circuit boards covering at least a portion of a faceof the electronic device such that the aperture is positioned over thelens.
 23. The electronic device according to claim 20: wherein one ofthe plurality of rigid circuit boards includes a connector, theconnector to allow the electronic device to control an illuminationdevice, the illumination device being at least one of packaged with theelectronic device and a remote illumination device.
 24. The electronicdevice according to claim 20: wherein a lens extender is mounted to thecarrier frame, and the lens is mounted to the lens extender.
 25. Amethod for assembling an electronic device, the method comprising:providing a carrier frame, the carrier frame including a plurality ofrestraints to support an electronic circuit board; providing anelectronic circuit board, the electronic circuit board including avision sensor and a processor; bending the electronic circuit boardaround at least a portion of the carrier frame; engaging the electroniccircuit board with the plurality of restraints; positioning a lens overthe vision sensor, the carrier frame supporting the lens over the visionsensor; and restraining the lens with a lens focus fix, the lens focusfix contacting the lens and the carrier frame, such that rotating thelens focus fix a first distance in a first direction causes the lens torotate a second distance in the first direction.
 26. The methodaccording to claim 25: further including acquiring image data, and usingthe processor for decoding the acquired image data into a decoded image.27. The method according to claim 25: further including thermallycoupling a heat sink to the processor.
 28. The method according to claim25: wherein the electronic circuit board comprises a plurality ofcircuit boards coupled together with flexible circuit board.